Press Releases

With the global demand for semiconductors continuously rising, foundries face surging orders, pushing backend IC packaging and testing lines to near capacity. Since chip quality directly correlates with production efficiency, chip probing and sorting have become critical steps in the packaging and testing process. After probing, chips enter the next phase—the sorting process, which performs finer quality grading. By integrating advanced technologies such as machine vision, artificial intelligence (AI), and edge computing, combined with multi-axis synchronized control and high-efficiency hardware, manufacturers can effectively separate good chips from defective ones. Continuous process optimi...